Paper
Ori-Sense: origami capacitive sensing for soft robotic applications
Authors
Hugo de Souza Oliveira, Xin Li, Mohsen Jafarpour, Edoardo Milana
Abstract
This work introduces Ori-Sense, a compliant capacitive sensor inspired by the inverted Kresling origami pattern. The device translates torsional deformation into measurable capacitance changes, enabling proprioceptive feedback for soft robotic systems. Using dissolvable-core molding, we fabricated a monolithic silicone structure with embedded conductive TPU electrodes, forming an integrated soft capacitor. Mechanical characterization revealed low stiffness and minimal impedance, with torque values below 0.01 N mm for axial displacements between -15 mm and 15 mm, and up to 0.03 N mm at 30 degrees twist under compression. Finite-element simulations confirmed localized stresses along fold lines and validated the measured torque-rotation response. Electrical tests showed consistent capacitance modulation up to 30%, directly correlated with the twist angle, and maximal sensitivity of S_theta ~ 0.0067 pF/deg at 5 mm of axial deformation.
Metadata
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Raw Data (Debug)
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"raw_xml": "<entry>\n <id>http://arxiv.org/abs/2602.18379v1</id>\n <title>Ori-Sense: origami capacitive sensing for soft robotic applications</title>\n <updated>2026-02-20T17:39:16Z</updated>\n <link href='https://arxiv.org/abs/2602.18379v1' rel='alternate' type='text/html'/>\n <link href='https://arxiv.org/pdf/2602.18379v1' rel='related' title='pdf' type='application/pdf'/>\n <summary>This work introduces Ori-Sense, a compliant capacitive sensor inspired by the inverted Kresling origami pattern. The device translates torsional deformation into measurable capacitance changes, enabling proprioceptive feedback for soft robotic systems. Using dissolvable-core molding, we fabricated a monolithic silicone structure with embedded conductive TPU electrodes, forming an integrated soft capacitor. Mechanical characterization revealed low stiffness and minimal impedance, with torque values below 0.01 N mm for axial displacements between -15 mm and 15 mm, and up to 0.03 N mm at 30 degrees twist under compression. Finite-element simulations confirmed localized stresses along fold lines and validated the measured torque-rotation response. Electrical tests showed consistent capacitance modulation up to 30%, directly correlated with the twist angle, and maximal sensitivity of S_theta ~ 0.0067 pF/deg at 5 mm of axial deformation.</summary>\n <category scheme='http://arxiv.org/schemas/atom' term='cs.RO'/>\n <category scheme='http://arxiv.org/schemas/atom' term='cond-mat.soft'/>\n <published>2026-02-20T17:39:16Z</published>\n <arxiv:comment>9th IEEE-RAS International Conference on Soft Robotics (RoboSoft 2026)</arxiv:comment>\n <arxiv:primary_category term='cs.RO'/>\n <author>\n <name>Hugo de Souza Oliveira</name>\n </author>\n <author>\n <name>Xin Li</name>\n </author>\n <author>\n <name>Mohsen Jafarpour</name>\n </author>\n <author>\n <name>Edoardo Milana</name>\n </author>\n </entry>"
}